On the afternoon of June 26, a “Chain-based Gathering” themed “Chip-Level Thermal Conductivity and Functional Packaging Materials” was held at the Lishui Development Zone. As a key brand of market-expansion and supply-demand matching events developed by the Nanjing Municipal Bureau of Industry and Information Technology, “Ning Gong Pin Tui” brought 18 key Nanjing-based enterprises in the electronics and integrated circuit sectors to Nanjing Abner New Materials Co., Ltd. to facilitate a “mutual engagement” between upstream and downstream players in the industrial chain.
“As AI computing power increases, heat dissipation becomes a major challenge. The AI computing power array thermal interface materials, graphene thermal pads, and thermal structural adhesives we’re showcasing today are specifically designed to address this critical issue of ‘heat.’” Right at the start of the event, the host, Nanjing Abner, immediately presented its innovative products and service portfolio.
This national-level “Little Giant” enterprise—a specialized, refined, distinctive, and innovative company that has been based in Lishui for nearly 20 years—has long focused on the research, development, and manufacturing of impregnation and sealing solutions for light alloy die-cast parts, structural adhesives, surface engineering materials, and advanced semiconductor packaging materials.
From heat dissipation for base station power amplifier modules to thermal management for server CPUs and GPUs, and on to the bonding and protection of main control chips in consumer electronics, Ebner presented a comprehensive suite of material solutions—covering everything from chip packaging to finished devices—and extended an invitation for collaboration to the companies in attendance.
As soon as the presentation segment ended, the 40-minute discussion that had been scheduled sparked a flurry of interaction.
“The AI thermal management materials you just introduced are a perfect fit for our communications equipment!” “The automotive electronic components we manufacture involve soldering and assembly, so we definitely need structural adhesives!” “Our LED display screens and radar testing equipment both require encapsulation materials!” … Technical leaders from companies such as ZTE, Panda Electronics, Nanjing Luopu, and the 55th Research Institute all extended offers of cooperation.
Through this Q&A session, technical needs and product offerings came together in a precise match, and many company representatives exchanged contact information on the spot, agreeing to have “in-depth discussions” later.
“What companies need is exactly what we’re here to do,” said officials from the municipal and district bureaus of industry and information technology at the event. “The ‘Ninggongpin Promotion’ initiative is designed to target leading companies in specific sectors, focus on their core products, and invite ‘buyers’ with genuine needs from across the industrial chain—both upstream and downstream—to engage in face-to-face discussions about technology and cooperation.”
This “small but beautiful” matchmaking event, by precisely matching supply and demand and streamlining the channels between them, not only helps “specialized, refined, distinctive, and innovative” new materials companies like Abner find potential customers, but also enables supply chain leaders such as ZTE and the 55th Research Institute to expand their local “network” of supply chain partners.
The Event Comes to a Close, and the Partnership Begins
A series of “Ninggong Product Promotion” special events
Building Nanjing's Industrial Ecosystem
"Even closer"
